深圳市百千成电子有限公司

Surface Mount Assembly

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1.Sreen Printing ( Solder Paste Application ) 
 Accurate control of the solder paste screen printing process is paramount for reliable surface mount PCB assembly.The solder paste screen must be lined up accurately to the PCB before it is printed. In BQC, our SMT lines equipped with auto solder paste printing machine which is computer control with manual and fully automatic fiducial alignment, that virtually eliminates the possibility of mis-aligned solder paste prints. Once the process variables are finalised the data is stored on line allowing fast and accurate set up for future batches.

2. Surface Mount Pick & Place with AOI
JUKI Assemble on High Speed SMT Lines
FUJI QP42
FUJI GP6431
JUKI KE-2050CM
JUKI KE-2060M
JUKI-2070LV
Component Range :  0201 to QFP, CSP, TSOP, SOJ, BGA, uBGA
Max height :  5.7mm (Topaz):20mm (Eclipse)
Tape Feeders :  Max 90 (8mm - 44mm tape)
Trays :  LCS with 40 pallets, Stick, tube, waffle pack                                       
Board size :  Max 460 x 440mm : min 50 x 50mm
Board Thickness :  0.4 to 4.0mm

3. Reflow Soldering

The soldering of complex SMD PCBs and new housing technologies requires an exact controlled soldering process. The JT AS-800 is a pure convection oven, allowing fast and homogenous heating. The implemented convection technology uses a vertical airflow for efficient heat transfer making soldering of lead-free components possible.

 The temperature of the three pre-heating zones and the two peak zones, along with the conveyor speed, are programmable to obtain the required soldering profile. Measuring the zone temperatures in the convection airflow, directly at the height of the PCB, guarantees reproducable results. Different suggested profiles for solder and glue are already integrated in the microprocessor control. The universal mesh conveyor system is the ideal solution for productions with frequent PCB changeover

4,Our PCBA equipment

JUKI-2070LV Chip Mounter 1 set; Reflow Soldering Oven 4 sets
Auto Loader &auto-printing machine 6 sets; Wave soldering oven
ICT machine; AOI Detector 3 sets; Auto Solder Paste Printing Machine 6 sets
FUJI QP42 Chip Mounter 3 Sets; FUJI GP643 Chip Mounter 4 sets
JUKI KE-2050CM Chip Mounter 2 sets; JUKI KE-2060M Chip Mounter 1 set
Auto Picking Machine 3 sets
X-RAY 8200 1 set
Stencil Cleaner 1 set


 

5,Manufacturing Productivity
a.SMT productivity: 8 complete automatic SMT production lines, populating 7 million dots per day;


 

b.Can Do The Following Components Package
01005, 0201, 0402,0603,0805,1206,2512
QFP,QFN,CSP,TSOP,SOJ,BGA,uBGA,etc

c.Mounting Operational Capacity Parameters
Pcb layer:1-16layers; Pcb material:FR-4,CEM-1,CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2
Pcb thickness:0.2mm-7.0mm; Pcb dimension:50*50mm-500*500mm
Copper thickness:0.5oz Min.;5.0oz Max; Chip accuracy:laser recognition±0.05mm;image recognition±0.03mm
Component size:0.6*0.3mm-33.5*33.5mm; Component height:6mm(max)
Pin spacing:laser recognition over 0.65mm;high resolution VCS 0.2mm
Spherical surface spacing:laser recognition over 1.0;high resolution VCS 0.25mm
BGA spherical distance: ≥0.25mm; BGA Globe distance: ≥0.25mm; BGA ball diameter: ≥0.1mm; IC foot distance: ≥ 0.2mm.